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        • BOE MLED COB

          Compared with traditional products equipped with front-loaded chips, BOE COB products with RGB full flip chip technology continue to improve the transmittance rate of the black film encapsulation program. It has more outstanding performance due to high protection and high reliability.

          • BOE MLED COB

          • BOE MLED COB

          • BOE MLED COB

        • Product Highlights

        • Cases

        • Product Parameters

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        Product Highlights

        • RGB full flip

          Reduce cost and improve quality

        • Thin Package

          Thinner<250um

        • Black film package

          Continue to improve picture quality

        • Common cathode drive

          Better experience closer to the screen

        • High protection and high reliability

          Reduce transport and maintenance risks

        • Power/Dual-Link solution

          Major projects are guaranteed

        • Overseas qualification

          Products are available for sale overseas

        • Curved splicing

          Enable multiple scenarios

        Product Parameters

        BYH-COB
        Specifications BYH009 Ultra BYH009V1 BYH012V1 BYH015V1
        Pitch 0.9375 0.9375 1.25 1.5
        Module Size（mm） 150*337.5 150*168.75
        Cabinet Dimension（mm） 600*337.5 600*337.5
        Maintenance Mode Front
        Cabinet flatness（mm） ≤0.1
        White balance brightness（cd/m2） Typ 1500 Typ 600, 0 - 800 Adjustable
        Refresh Rate（Hz） 7680 3840
        Installation mode Stacking & Wall mounting

        * Please click on the bottom of the project for more product details.

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